LICENSE,DISCLAIMEROFLIABILITY,ANDLIMITEDWARRANTYBypurchasingorusingthisbook(the“Work”),youagreethatthislicensegrantspermissiontousethecontentscontainedherein,butdoesnotgiveyoutherightofownershiptoanyofthetextualcontentinthebookorownershiptoanyoftheinformationorproductscontainedinit.ThislicensedoesnotpermituploadingoftheWorkontotheInternetoronanetwork(ofanykind)withoutthewrittenconsentofthePublisher.Duplicationordisseminationofanytext,code,simulations,images,etc.containedhereinislimitedtoandsubjecttolicensingtermsfortherespectiveproducts,andpermissionmustbeobtainedfromthePublisherortheownerofthecontent,etc.,inordertoreproduceornetworkanyportionofthetextualmaterial(inanymedia)thatiscontainedintheWork.MERCURYLEARNINGANDINFORMATION(“MLI”or“thePublisher”)andanyoneinvolvedinthecreation,writing,orproductionofthecompaniondisc,accompanyingalgorithms,code,orcomputerprograms(“thesoftware”),andanyaccompanyingWebsiteorsoftwareoftheWork,cannotanddonotwarranttheperformanceorresultsthatmightbeobtainedbyusingthecontentsoftheWork.Theauthor,developers,andthePublisherhaveusedtheirbesteffortstoinsuretheaccuracyandfunctionalityofthetextualmaterialand/orprogramscontainedinthispackage;we,however,makenowarrantyofanykind,expressorimplied,regardingtheperformanceofthesecontentsorprograms.TheWorkissold“asis”withoutwarranty(exceptfordefectivematerialsusedinmanufacturingthebookorduetofaultyworkmanship).Theauthor,developers,andthepublisherofanyaccompanyingcontent,andanyoneinvolvedinthecomposition,production,andmanufacturingofthisworkwillnotbeliablefordamagesofanykindarisingoutoftheuseof(ortheinabilitytouse)thealgorithms,sourcecode,computerprograms,ortextualmaterialcontainedinthispublication.Thisincludes,butisnotlimitedto,lossofrevenueorprofit,orotherincidental,physical,orconsequentialdamagesarisingoutoftheuseofthisWork.Thesoleremedyintheeventofaclaimofanykindisexpresslylimitedtoreplacementofthebook,andonlyatthediscretionofthePublisher.Theuseof“impliedwarranty”andcertain“exclusions”varyfromstatetostate,andmightnotapplytothepurchaserofthisproduct.MULTIPHYSICSMODELINGUsingCOMSOL®5andMATLAB®RogerW.Pryor,PhDCopyright©2016byMERCURYLEARNINGANDINFORMATIONLLC.Allrightsreserved.Thispublication,portionsofit,oranyaccompanyingsoftwaremaynotbereproducedinanyway,storedinaretrievalsystemofanytype,ortransmittedbyanymeans,media,electronicdisplayormechanicaldisplay,including,butnotlimitedto,photocopy,recording,Internetpostings,orscanning,withoutpriorpermissioninwritingfromthepublisher.Publisher:DavidPallaiMERCURYLEARNINGANDINFORMATION22841QuicksilverDriveDulles,VA20166info@merclearning.comwww.merclearning.com(800)232-0223RogerW.Pryor.MultiphysicsModelingUsingCOMSOL®5andMATLAB®ISBN:978-1-938549-98-4Thepublisherrecognizesandrespectsallmarksusedbycompanies,manufacturers,anddevelopersasameanstodistinguishtheirproducts.Allbrandnamesandproductnamesmentionedinthisbookaretrademarksorservicemarksoftheirrespectivecompanies.Anyomissionormisuse(ofanykind)ofservicemarksortrademarks,etc.isnotanattempttoinfringeonthepropertyofothers.LibraryofCongressControlNumber:2015910193151617321Thisbookisprintedonacid-freepaper.Ourtitlesareavailableforadoption,license,orbulkpurchasebyinstitutions,corporations,etc.Foradditionalinformation,pleasecontacttheCustomerServiceDept.at800-232-0223(tollfree).Allofourtitlesareavailableindigitalformatatauthorcloudware.comandotherdigitalvendors.Companionfiles(figuresandcodelistings)forthistitleareavailablebycontactinginfo@merclearning.com.ThesoleobligationofMERCURYLEARNINGANDINFORMATIONtothepurchaseristoreplacethedisc,basedondefectivematerialsorfaultyworkmanship,butnotbasedontheoperationorfunctionalityoftheproduct.CONTENTSPrefaceIntroductionChapter1ModelingMethodologyUsingCOMSOLMultiphysics5.xGuidelinesforNewCOMSOLMultiphysics5.xModelersHardwareConsiderationsSimpleModelSetupOverviewBasicProblemFormulationandImplicitAssumptions1DWindowHeatFlowModels1D1PaneWindowHeatFlowModel1D2PaneWindowHeatFlowModel1D3PaneWindowHeatFlowModelFirstPrinciplesasAppliedtoModelDefinitionSomeCommonSourcesofModelingErrorsReferencesSuggestedModelingExercisesChapter2MaterialsPropertiesUsingCOMSOLMultiphysics5.xMaterialsPropertiesGuidelinesandConsiderationsCOMSOLMaterialsPropertiesSourcesOtherMaterialsPropertiesSourcesMaterialPropertyEntryTechniquesMultipaneWindowModelSetBoundaryConditionsReferencesChapter30DElectricalCircuitInterfaceModelingUsingCOMSOLMultiphysics5.xGuidelinesforElectricalCircuitInterfaceModelingin5.xElectrical/ElectronicCircuitConsiderationsSimpleElectricalCircuitInterfaceModelSetupOverviewBasicProblemFormulationandImplicitAssumptions0DBasicCircuitModels0DResistor-CapacitorSeriesCircuitModel0DInductor-ResistorSeriesCircuitModel0DSeries-ResistorParallel-Inductor-CapacitorCircuitModel0DBasicCircuitModelsAnalysisandConclusionsFirstPrinciplesasAppliedto0DModelDefinitionReferencesSuggestedModelingExercisesChapter41DModelingUsingCOMSOLMultiphysics5.xGuidelinesfor1DModelingin5.x1DModelingConsiderations1DBasicModels1DKdVEquationModel1DTelegraphEquationModel1DTelegraphEquationModelSummaryandConclusions1DSphericallySymmetricTransportModel1DSphericallySymmetricTransportModelAnimationFirstPrinciplesasAppliedto1DModelDefinitionReferencesSuggestedModelingExercisesChapter52DModelingUsingCOMSOLMultiphysics5.xGuidelinesfor2DModelingin5.x2DModelingConsiderations2DBasicModels2DElectrochemicalPolishingModel2DHallEffectModelFirstPrinciplesasAppliedto2DModelDefinitionReferencesSuggestedModelingExercisesChapter62DAxisymmetricModelingUsingCOMSOLMultiphysics5.xGuidelinesfor2DAxisymmetricModelingin5.x2DAxisymmetricModelingConsiderations2DAxisymmetricHeatConductioninaCylinderModel2DAxisymmetricBasicModels2DAxisymmetricCylinderConductionModel2DAxisymmetricTransientHeatTransferModelFirstPrinciplesasAppliedto2DAxisymmetricModelDefinitionReferencesSuggestedModelingExercisesChapter72DSimpleMixedModeModelingUsingCOMSOLMultiphysics5.xGuidelinesfor2DSimpleMixedModeModelingin5.x2DSimpleMixedModeModelingConsiderations2DSimpleMixedModeModels2DElectricImpedanceSensorModel2DMetalLayeronaDielectricBlockModelHeatTransfer2(ht2)InterfaceFirstPrinciplesasAppliedto2DSimpleMixedModeModelDefinitionReferencesSuggestedModelingExercisesChapter82DComplexMixedModeModelingUsingCOMSOLMultiphysics5.xGuidelinesfor2DComplexMixedModeModelingin5.x2DComplexMixedModeModelingConsiderations2DComplexMixedModeModels2DCopperElectroplatingModel2DCopperElectroplatingModelSummaryandConclusions2DElectrocoalescenceOil/WaterSeparationModelTime-DependentSolver22DElectrocoalescenceOil/WaterSeparationModelSummaryandConclusionsFirstPrinciplesasAppliedto2DComplexMixedModeModelDefinitionReferencesSuggestedModelingExercisesChapter93DModelingUsingCOMSOLMultiphysics5.xGuidelinesfor3DModelingin5.x3DModelingConsiderations3DModels3DSpiralCoilMicroinductorModel3DSpiralCoilMicroinductorModelSummaryandConclusions3DLinearMicroresistorBeamModelMultiphysicsThermalLinearElastic1(te1).HeatTransferinSolids(ht).FirstPrinciplesasAppliedto3DModelDefinitionReferencesSuggestedModelingExercisesChapter10PerfectlyMatchedLayerModelsUsingCOMSOLMultiphysics5.xGuidelinesforPerfectlyMatchedLayer(PML)Modelingin5.xPerfectlyMatchedLayer(PML)ModelingGuidelinesandCoordinateConsiderationsPerfectlyMatchedLayerModelsBuildingthe2DConcaveMetallicMirrorPMLModelBuildingthe2DEnergyConcentratorPMLModelFirstPrinciplesasAppliedtoPMLModelDefinitionReferencesSuggestedModelingExercisesChapter11BioheatModelsUsingCOMSOLMultiphysics5.xGuidelinesforBioheatModelingin5.xBioheatModelingConsiderationsBioheatTransferModels2DAxisymmetricMicrowaveCancerTherapyModelFirstPrinciplesasAppliedtoBioheatModelDefinitionReferencesSuggestedModelingExercisesAppendixABriefIntroductiontoLiveLinkTMforMATLAB®A.AppendixABriefIntroductiontoCOMSOLApplicationBuilderB.IndexPREFACEThepurposeofthisbookistointroducehands-onmodelbuildingandsolvingwithCOMSOLMultiphysics®softwareversion5toscientists,engineers,andotherpersonsinterestedinexploringthebehaviorofphysicaldevicestructuresbuiltonacomputer(avirtualprototype),beforegoingtotheworkshoporlaboratoryandtryingtobuildthewhatever-it-is(arealprototype).Themodelspresentedhereinarebuiltwithinthecontextofthelawsofthephysicalworld(appliedphysics)andareexploredinlightofFirstPrincipleAnalysistechniques.Aswithanyothermethodofproblem-solution,theinformationobtainedthroughtheuseofsolutionstothesecomputersimulations(virtualprototypes)isonlyasaccurateasthematerialsproperties’valuesandthefundamentalassumptionsemployedtobuildthesesimulations.Theprimaryadvantageofthecombinationofcomputersimulation(virtualprototyping)andFirstPrinciplesAnalysistoexploreartifacts(devicestructures)isthatthemodelercantryasmanydifferentapproachestothesolutionofthesameunderlyingproblemasareneededinordertogetitright(orclosethereto)forthefirsttime,beforefabricationofthedevicecomponentsandtheassembleddevice(realprototype)intheworkshoporlaboratory.ACKNOWLEDGMENTSIwouldliketothankDavidPallaiofMercuryLearningandInformationforhisongoingencouragement.IwouldalsoliketothankthemanystaffmembersofCOMSOL,Inc.fortheirhelpandencouragement.IwouldespeciallyliketothankBeverlyE.Pryor,mywife,forherpatienceandencouragementduringthecreationofthemanuscriptofthisbook.Anyresidualerrorsinthisworkaremineandminealone.RogerW.Pryor,PhDJuly2015INTRODUCTIONCOMSOLMultiphysicssoftwareisapowerfulFiniteElement(FEM),PartialDifferentialEquation(PDE)solutionengine.ThebasicCOMSOLMultiphysics5.xsoftwarehasovertwentyfive(25)add-onmodulesthatexpandthecapabilitiesofthebasicsoftwareintoabroadcollectionofapplicationareas:AC/DC,Acoustics,BatteriesandFuelCells,CFD,ChemicalReactionEngineering,Electrodeposition,Geomechanics,HeatTransfer,MEMS,Microfluidics,Plasma,RF,StructuralMechanicsandSubsurfaceFlow,tonameafew.TheCOMSOLMultiphysicssoftwarealsohasothersupportingsoftware,suchas:theOptimizationModule,theMaterialLibraryModule,theCADImportModuleandLiveLink™interfacesforseveralengineeringsoftwareprograms.Inthisbook,scientists,engineers,andothersinterestedinexploringthebehaviorofdifferentphysicaldevicestructuresthroughcomputermodelingareintroducedtothetechniquesofhands-onbuildingandsolvingmodelsthroughthedirectapplicationofthebasicCOMSOLMultiphysicssoftware,alongwithsomesamplesusingtheAC/DC,ChemicalReactionEngineering,HeatTransfer,MEMS,andRFmodules.ThenexttothelasttechnicalchapterexplorestheuseofPerfectlyMatchedLayersintheRFModule.ThefinaltechnicalchapterexplorestheuseoftheBioheatEquationintheHeatTransferandRFModules.Themodelspresentedhereinarebuiltwithinthecontextofthephysicalworld(appliedphysics)andarepresentedinlightofFirstPrincipleAnalysistechniques.Thedemonstrationmodelsemphasizethefundamentalconceptthattheinformationderivedfromthemodelingsolutionsthroughuseofthesecomputersimulationsisonlyasgoodasthematerialscoefficientsandthefundamentalassumptionsemployedinbuildingthemodels.ThecombinationofcomputersimulationandFirstPrinciplesAnalysisgivesthemodelertheopportunitytotryavarietyofapproachestothesolutionofthesameproblemasneededinordertogetthedesignrightornearlyrightintheworkshoporlaboratorybeforethefirstdevicecomponentsarefabricatedandtested.Themodelercanalsousethephysicaldevicetestresultstomodifythemodelparametersandarriveatanimprovedsolutionmorerapidlythanbysimplyusingthecutandtrymethodology.CHAPTERTOPICSTheeleven(11)technicalchaptersinthisbookdemonstratetothereaderthehandsontechniqueofmodelbuildingandsolving.TheCOMSOLconceptsandtechniquesusedinthesechaptersareshowninFigureInt.1.FIGUREINT.1COMSOLConceptsandtechniquesTheCOMSOLmodulesemployedinthevariousmodelsinspecificchaptersareshowninFigureInt.2,andthephysicsconceptsandtechniquesemployedinthevariousmodelsinspecificchaptersareshowninFigureInt.3.FIGUREINT.2COMSOLModulesemployedFIGUREINT.3PhysicsConceptsandtechniquesTheinformationinthesethreefigureslinktheoverallpresentationofthisbooktotheunderlyingmodeling,mathematical,andphysicalconcepts.Inthisbook,incontrasttosomeotherbookswithwhichthereadermaybefamiliar,keyancillaryinformationis,inmostcases,containedinthenotes.NOTEPleasebesuretoread,carefullyconsider,andapply,asneeded,eachnote.CHAPTER1.MODELINGMETHODOLOGYChapter1providesanoverviewofthemodelingprocessbydiscussingthefundamentalconsiderationsinvolved:thehardware(computerplatform),thecoordinatesystems(physics),theimplicitassumptions(lowerdimensionalityconsiderations),andFirstPrinciplesAnalysis(physics).Threerelativelysimple1Dmodelsarepresentedthatbuildandsolve,forcomparison,single-,double-,andtriple-panethermalinsulationwindowstructures.Commentsarealsoincludedoncommonsourcesofmodelingerrors.CHAPTER2.MATERIALSPROPERTIESChapter2discussesvarioussourcesofmaterialspropertiesdata,includingtheCOMSOLMaterialLibrary,basicandexpandedmodule,aswellasprintandInternetsources.Amulti-panelthermalinsulationwindowstructuremodeldemonstratesthreetechniquesforenteringmaterialproperties:user-defineddirectentry,user-definedparameters,andmaterialdefinitions.AlsoincludedareinstructionsforbuildingauserdefinedmateriallibraryforstoragewithinCOMSOL5.x.CHAPTER3.0DELECTRICALCIRCUITINTERFACECOMSOL5.xuseszero-dimensionalmodelstoprovideforthemodelingofelectricalcircuitry.Themodelsinthischapterillustratetechniquesformodelingvariousbasiccircuits:aresistor-capacitorseriescircuit,aninductor-resistorseriescircuit,andaseriesresistor,parallelinductor-capacitorcircuit.ConsiderationsforthepropersetupofthecircuitsarediscussedalongwiththebasicsofproblemformulationandtheimplicitassumptionsbuiltintoCOMSOL5.xrelativetoelectricalcircuitmodeling.CHAPTER4.1DMODELINGThefirstpartofChapter4modelsthe1DKdVEquation.TheKdVEquationisapowerfultoolthatisusedtomodelsolitonwavepropagationindiversemedia(e.g.physicalwavesinliquids,electromagneticwavesintransparentmedia,etc.).Itiseasilyandsimplymodeledwitha1DPDEmodemodel.ThesecondpartofChapter4modelsthe1DTelegraphEquation.TheTelegraphEquationisapowerfultoolthatisusedtomodelwavepropagationindiversetransmissionlines.TheTelegraphEquationcanbeusedtothoroughlycharacterizethepropagationconditionsofcoaxiallines,twinpairlines,microstriplines,etc.TheTelegraphEquationiseasilyandsimplymodeledwitha1DPDEmodemodel.ThelastpartofChapter4isa1DSphericallySymmetricTransportmodelthatillustratesthetechniqueofsimplifyingmodelswithsphericalcomponentsfrom3Dto1Dbyassumingthattheyareessentiallysymmetrical.更多内容见附件免责声明：本页面/内容部分素材来源于互联网公开信息，旨在传递更多信息，不代表本平台立场。版权归原作者或机构所有，如涉及侵权，请通过平台联系我们，我们将在核实后第一时间处理。本平台对转载内容的真实性、准确性不作任何保证，用户需自行判断并承担使用风险。
