ArcSoft与Cadence携手开发 AI和视觉应用

近期，一年一度的CDNLive全球用户大会CDNLive China在上海召开。PCB分会场有何精彩内容？行业有何最新动态？Cadence PCB/封装领域有何开发战略？小编专门采访了Cadence Allegro研发副总裁Saugat Sen，为大家带来独家报道。展讯获得杰出论文奖，Mr.Saugat为颁奖嘉宾PCB分会场，Mr. Saugat发表了题为“运用Allegro技术实现系统级设计”的主题演讲，现场人气爆棚会后，小编有幸对Saugat先生进行了独家专访。您关注的问题都在这里啦~1针对未来的硬件设计，Allegro的开发战略是怎样的？Allegro一直在发展，以解决更复杂的系统级设计问题，与Cadence 公司创新的“系统设计实现”（SDE）战略相一致。 我们认识到，客户现今面临的设计挑战是跨学科的。 我们需要将执行和分析协同进行，需要在设计早期发现制造问题，还需要在机电领域之间实现协作。 我们的战略是与全球领先的客户合作，创新运用我们所有的技术资产，以解决跨芯片、封装、电路板和多板系统的设计挑战。Allegro has been evolving to address the larger issues of System Level Design, aligned with Cadence’s strategy of System Design Enablement. We recognize that the customers’ design challenges today are inter-disciplinary. There is a need to blend implementation and an alysis, there is a need to identify manufacturing issues early in design, there is also the need to enable collaboration across mechanical and electrical domains. Our strategy is to collaborate with leading customers across the world, to innovate and leverage all our technology assets to enable solving design challenges that span Chip, Package, Board and the System of multiple boards.2如何缩短产品上市时间？我们推进Allegro的动力之一就是为了显著提高客户的生产力。 我们的协同团队设计解决方案——Allegro Symphony只是工具之一。 我们正在推进ECAD / MCAD协同设计，并且将分析和设计密切配合。 我们致力于优化Allegro，以帮助客户大大缩短PCB设计周期。One of the key vectors that we are driving Allegro on is to significantly improve customer productivity. Our concurrent team design solution - Allegro Symphony is just one example of enabling this. We are making progress in ECAD/MCAD co-design, and blending ana lysis and design closely. It is our endeavor to evolve Allegro to make transformational improvements in our customers’ ability to shorten the PCB design cycle time.3未来如何保障制造业的成功？我们有多种解决方案来满足制造业设计成功的需要，包括最新的Cadence Allegro DesignTrue DFM技术。该技术为业界首款实时、在线的可制造性设计（DFM）解决方案，集成了电气、物理和空间的设计规则检查（DRC）。 基于丰富的客户经验，我们相信，需要尽早在设计阶段确定问题，以减少端到端的PCB周期。We have multiple solutions to address the needs of design for manufacturing success, including new Cadence Allegro DesignTrue DFM Technology, the industry’s first solution to perform real-time, in-design design-for-manufacturing (DFM) checks integrated with electrical, physical and spacing design rule checks (DRCs). Our experience with customers leads us to believe that we need to identify the issues as early as possible in the design process so as to reduce the end to end PCB cycle time. 4您如何看待中国PCB/封装市场？中国在多个领域已明显表现出在科技方面的思想领导地位。 虽然中国的企业多年来一直在PCB领域处于领先地位，但我们也期望在IC封装领域也有类似的趋势。 我们很幸运能够与中国客户进行合作。 我们期待与他们共同发展技术，以满足他们的需求，服务全球客户。China is clearly establishing its thought leadership in technology across multiple domains. While companies in China has been doing leading edge work in PCB for many years, we expect a similar trend in IC Packaging as well. We are fortunate to be in a position to collaborate with our customers in China. We look forward to partner with them in evolving our technology to serve their needs and our customers worldwide.来源：Cadence楷登