通常在建立新的材料(assign new material)时,填写的都是固定的介电常数Dk和介质损耗Df,比方PCB板厂提供的板材信息是FR4 Dk=4.2、Df=0.018,直接填入这两个数值即可。但较专业的板厂会告诉你Dk=4.2、Df=0.018@1GHz, 这种表示方法很明显已经说明了Dk跟Df是随频率变化的,板厂提供的数据只是基于1GHz所量到的特性,那么在仿真时该如何设定这种材料属性随频率变化的情况呢?
如果分析的是窄带问题,按照固定的Dk和Df进行仿真,对仿真结果并不会有什么影响,即使DK和Df跟频率相关,也可忽略;如果是SI或者EMC宽频问题仿真,仍然按照按照固定的Dk和Df进行仿真,这会引起数值模拟上所谓“因果性”问题。
由于PCB厂家经常提供的是单个频点的Dk和Df值,如何由单个频点推及到整个频带,正确建立介质材料的频响模型,HFSS中有两种方法,不过使用的都是D-S material model,help说明如下:
In other cases, especially when the permittivity and loss tangent are known at only one or two frequencies, the broad band Djordjevic - Sarkar (D-S) material model can be used.
D-S material model是一种满足因果性的介质材料模型,字面上是指材料的复介电常数的实部和虚部要满足因果性,实际上说的是系统的输出响应时间不可能比输入信号时间早,HFSS跟时域相关的只有TDR,如果TDR曲线在t=0之前还有取值,必然是出现了因果性问题,需要慎重对待,如下图所示:
模型建立方法:
在add new material 时,点击set freqquency dependency,选择D-S model input。
在弹窗中输入测试频点频率,测试频点的Dk和Df,high-frequency corner至少要是测试频点的10倍大,不然软件报错,建议保持默认值即可。DC介质电导率设置为0,或者设置其直流相对介电常数。
The value of the High-frequency Corner (GHz) should be at least 10 times higher than the Fre-quency. If not, an error message is issued.
按ok后,再看其Dk和Df,不再是一个固定值,而是一个跟频率相关的函数了
Dk(Freq)=3.74076+0.0255671*ln((2.53303e+022+Freq*Freq)/(4.95658e+009+Freq*Freq));
Df(Freq)=1e-012+2.84472e-012*Freq*(atan(Freq/70403)-atan(Freq/1.59155e+011))
如此便建立一个跟频率相关的D-S material model,如下二图粉色曲线,Dk和Df已经是随频率变化的数值了。
在HFSS design setting中使用Automatically use causal materials,具有同样效果,help解释如下:
This option applies frequency dependent lossy materials for the solver and post processor. The materials are not modified in the design. Instead, the Djordjevic-Sarkar model is applied before the material is passed to the solver or used for post processing.
请注意以下几种特殊情况,Automatically use causal materials将失效。
If the solution type is eigenmode
If the material permittivity or loss tangent is anisotropic
If the material permittivity or loss tangent is spatially dependent
If the material permittivity or loss tangent is frequency dependent
If the material itself is not a lossy dielectric
别的不知道,如果是分析SI问题,D-S material model最合适,因为:
This model was developed for low-loss dielectric materials (particularly FR-4) commonly used in printed circuit boards and packages.